Papers - Toshiki Kanamoto
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パワーモジュールの熱応力連成解析に向けたIGBT等価回路モデルの検討
伊藤颯汰, 宗形恒夫, 黒川敦, 今井雅, 金本俊幾
情報処理学会東北支部研究報告 2019-6 ( 2-1 ) 1 - 4 2020.2
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LPWA通信規格LoRaを用いたセンサノードの低消費電力通信の評価
畠山寛, 丹波澄雄, 黒川敦, 今井雅, 金本俊幾
情報処理学会東北支部研究報告 2019-6 ( 2-2 ) 1 - 4 2020.2
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Thermal placement on PCB of components including 3D ICs
Satomi Yuuta, Hachiya Koutaro, Kanamoto Toshiki, Watanabe Ryosuke, Kurokawa Atsushi
IEICE Electronics Express 17 ( 3 ) 20190737 - 20190737 2020.1
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Thermal placement on PCB of components including 3D ICs
Yuuta Satomi, Koutaro Hachiya, Toshiki Kanamoto, Ryosuke Watanabe, Atsushi Kurokawa
IEICE Electronics Express 17 ( 3 ) 20190737 - 20190737 2020.1
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Thermal Resistance Model and Analysis for Future Smart Glasses
K.Matsuhashi, T.Kanamoto, A.Kurokawa
International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) 14 2019.10
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Thermal modeling and simulation of a smart wrist-worn wearable device
Kodai Matsuhashi, Koutaro Hachiya, Toshiki Kanamoto, Masashi Imai, Atsushi Kurokawa
Workshop on Synthesis And System Integration of Mixed Information technologies 2019 138 - 143 2019.10
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Efficiency investigation of capacitors mounted on re-distribution layers for FOWLP
Koki Kasai, Atsushi Kurokawa, Masashi Imai, and Toshiki Kanamoto
Workshop on Synthesis And System Integration of Mixed Information technologies 2019 176 - 179 2019.10
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Quantitative performance comparison of asynchronous and synchronous comparator
Kyota Akimoto, Toshiki Kanamoto, Atsushi Kurokawa, Masashi Imai
Workshop on Synthesis And System Integration of Mixed Information technologies 2019 296 - 297 2019.10
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An efficient thermal model of thin film NiCr resistors considering pulse response
Ryosuke Watanabe, Keita Izawa, Shota Kajiya, Taiki Tsunemoto, Koki Kasai, Atsushi Kurokawa, Toshiki Kanamoto
Workshop on Synthesis And System Integration of Mixed Information technologies 2019 164 - 167 2019.10
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An Efficient Thermal Model of Thin Film NiCr Resistors Considering Pulse Response
Ryosuke Watanabe, Keita Izawa, Shota Kajiya, Taiki Tsunemoto, Koki Kasai, Atsushi Kurokawa, Toshiki Kanamoto
Workshop on Synthesis And System Integration of Mixed Information technologies, SASIMI 164 - 167 2019.10
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Thermal Resistance Model and Analysis for Future Smart Glasses
Kodai Matsuhashi, Toshiki Kanamoto, Atsushi Kurokawa
International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 1 - 4 2019.10
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Thermal Modeling and Simulation of a Smart Wrist-Worn Wearable Device
Kodai Matsuhashi, Koutaro Hachiya, Toshiki Kanamoto, Masasi Imai, Atsushi Kurokawa
138 - 143 2019.10
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Quantitative Performance Comparison of Asynchronous and Synchronous Comparator
Kyota Akimoto, Toshiki Kanamoto, Atsushi Kurokawa, Masashi Imai
Workshop on Synthesis And System Integration of Mixed Information technologies, SASIMI 296 - 297 2019.10
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Efficiency Investigation of Capacitors Mounted on Re-Distribution Layers for FOWLP
Koki Kasai, Atsushi Kurokawa, Masashi Imai, Toshiki Kanamoto
Workshop on Synthesis And System Integration of Mixed Information technologies, SASIMI 176 - 179 2019.10
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A Multicore Chip Load Model for PDN Analysis Considering Voltage–Current-Timing Interdependency and Operation Mode Transitions
Toshiki Kanamoto
IEEE Transactions on Components, Packaging and Manufacturing Technology 9 ( 9 ) 1669 - 1679 2019.9
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A Single-Stage RISC-V Processor to Mitigate the Von Neumann Bottleneck
Toshiki Kanamoto, Masami Fukushima, Koichi Kitagishi, Seijin Nakayama, Hideki Ishihara, Koki Kasai, Atsushi Kurokawa, Masashi Imai
IEEE International Midwest Symposium on Circuits and Systems, MWCAS 62 1085 - 1088 2019.8
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Hardware Trojan Insertion and Detection in Asynchronous Circuits
Koutaro Inaba, Tomohiro Yoneda, Toshiki Kanamoto, Atsushi Kurokawa, Masashi Imai
25th IEEE International Symposium on Asynchronous Circuits and Systems, ASYNC 2019, Hirosaki, Japan, May 12-15, 2019 25 134 - 143 2019.5
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Neural network-based 3D IC interconnect capacitance extraction
R. Kasai, T. Kanamoto, M. Imai, A. Kurokawa, K. Hachiya
International Conference on Communication Engineering and Technology (ICCET) 2 168 - 172 2019.4
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Neural Network-Based 3D IC Interconnect Capacitance Extraction
Ryosuke Kasai, Koutaro Hachiya, Toshiki Kanamoto, Masashi Imai, Atsushi Kurokawa
2019 2nd International Conference on Communication Engineering and Technology (ICCET 2019) 168 - 172 2019.4
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リストウェアラブルデバイスのベルト放熱効果
岡本慎太郎, 松橋功大, 今井雅, 金本俊幾, 黒川敦
電気学会 全国大会 講演論文集 32 2019.3